Cooling the RV2 Board Componentes
To ensure optimal cooling for critical board components such as the 512MB RAM, Sifower SF2H8898 SoC, and two ethernet control chips, we incorporated aluminum heatsinks, along with two extras in smaller dimensions. Below is a detailed list of these heatsinks and their dimensions:
no. | component | dimension |
1 | Sifower P1240-CT chip | 14 x 14 x 6 mm |
2 | Sifower SF2H8898 chip | 18 x 18 x 13.5 mm |
3 | 512MB DDR3 RAM | 13 x 2.8 x 24 mm |
4 | SF23P1240 1G PHY chip | 5.5 x 5.5 x 4.5 mm |
5 | EN8811H 2.5G PHY chip | 8 x 8 x 4.5 mm |
