A Closer Look at the Board
Case design
In this department, FriendlyElec company team is consistently doing an excellent job designing a top solution for cooling the board. The case is entirely made of raw metal material manufactured with CNC technology. It’s not made of sheet metal, so you can expect the most efficient cooling. The idea behind the case design is to protect the board and function as a big heatsink in one unit. This also saves the user the hassle of searching for a compatible heatsink.
The NanoPi R6C Case/Metal Enclosure
The downsides
Even though the board has a great design, the other components like the memory chips, including the eMMC chip, won’t cool down because they are not in direct contact with the case. Therefore, it would be necessary to buy a few extra thermal pads and cut them according to chip sizes to solve this minor issue.
| Item No. | Description | QTY | Required Thermal pad dimensions |
| 1 | Main SoC Chip | 1 | 20x20mm (t=0.5mm) [Included in the case kit] |
| 2,3 | Memory Chips | 2 | 11.5×13 mm (t=5mm) |
| 4 | eMMC Chip | 1 | 15x10x5 mm (t=5mm) |
Adding additional thermal pads.
